The rapid development of electronics has sparked a major trend towards the miniaturization of electronics. Both consumers and the industry are demanding more compact and powerful devices. This presents engineers and designers with the challenge of creating smaller yet more efficient and powerful electronic circuits. Industrial design and engineering must collaborate closely to meet these demands, merging aesthetics and functionality. This trend is not just focused on reducing size, but also on enhancing the performance and functionality of these devices. In this article, we will explore the latest trends in the miniaturization of electronics, along with the modern technologies and techniques that facilitate the creation of progressively more compact electronic devices. Additionally, we will offer practical tips for designers and engineers that can prove useful during the design process.
Modern technologies driving miniaturization
Advanced semiconductor materials such as gallium nitride (GaN) and silicon carbide (SiC) are driving the development of modern electronic circuits. Gallium nitride, with its wide bandgap, allows transistors to operate at higher voltages and temperatures, which is crucial for high-power applications, such as 5G network base stations and electric vehicle chargers. Silicon carbide offers superior thermal conductivity and enhanced mechanical strength, making it an ideal material for use in extreme environments, such as the automotive and space industries. Transistors made from these materials also exhibit reduced power losses during switching operations, which is key to improving the energy efficiency of devices. Industrial design, combined with the application of these advanced materials, enables the creation of devices with significantly improved energy efficiency.
Nanotechnology plays a crucial role in the miniaturization process, enabling the manipulation of materials at the atomic and molecular levels, allowing for the creation of structures only a few nanometers in size. One example is FinFET (Fin Field-Effect Transistor) transistors, which, thanks to their three-dimensional structure, increase the electrically conductive surface area, improving current flow control and reducing leakage currents. Nanotechnology also enables the production of materials with unique properties, such as highly thermally conductive nanolayers and graphene, a two-dimensional material applied in flexible displays and high energy density batteries due to its strength and excellent conductivity. These innovations in design and engineering create new opportunities in the design of electronic devices, offering enhanced functionality and higher performance.
3D integration will play a role in the further miniaturization of electronic circuits. In traditional integrated circuits, components were typically arranged on a single flat layer. 3D integration involves stacking layers of circuits on top of each other, greatly minimizing the area occupied by components on a PCB. This approach not only saves space but also shortens the distance electrical signals travel, resulting in faster device performance. However, one of the primary challenges of 3D integration is managing the accumulation of heat in densely packed structures. Advanced techniques, such as the use of embedded cooling channels and materials with high thermal conductivity, such as synthetic diamond, are being employed to efficiently dissipate heat and ensure stable device operation.
Flexible electronics enable the design of flexible and foldable devices that can be bent, twisted, and even folded without losing their functionality. Traditional electronic circuits were rigid, severely limiting their use in such flexible applications. Thanks to new materials such as conductive polymers and graphene, it is now possible to create flexible components. An example of this is graphene-based OLED screens, which feature thin, lightweight, and flexible designs, creating new opportunities in the design of wearable devices or technology integrated into clothing. Conductive polymers can also be used to produce flexible batteries and sensors, contributing to the development of fully flexible electronic systems.
A System-on-Chip (SoC) integrates all the essential electronic components of a computer or other system on a single chip, minimizing both the size and complexity of devices. An SoC combines the processor, memory, controllers, and other components into a single chip, significantly improving the energy efficiency and performance of the entire system. An example of this solution is the Apple M1, which integrates CPU, GPU, RAM, and other components into a single chip, enabling the creation of more compact, yet high-performance portable computers. In the context of IoT (Internet of Things), the SoC allows for the construction of miniaturized devices with high computing power that can operate for extended periods on battery power.
Challenges and design considerations.
Thermal management is becoming one of the biggest challenges in miniaturization, as smaller and smaller devices are increasingly susceptible to overheating. Excessive heating of components can lead to damage or reduced performance, requiring advanced cooling solutions. In the industrial design process, engineers are increasingly turning to cutting-edge methods such as liquid cooling microchannels, which use miniature channels embedded within the system’s structure to efficiently remove heat from the hottest areas. High-performance materials with high thermal conductivity, such as synthetic diamond and silicon carbide (SiC)-based composite materials, are increasingly being used to improve thermal management. Thanks to these innovations, designers and engineers are able to control temperatures more effectively, even in miniaturized, heavily packed devices.
Energy efficiency is a very important factor in the miniaturization process, especially in mobile devices, where limitations on available energy play an important role. In the industrial design process, engineers must implement technologies that maximize energy efficiency. One such solution is Dynamic Voltage and Frequency Scaling (DVFS), which allows the power consumption of a processor to be adjusted according to current needs, significantly extending battery life. An additional solution is powering down unused components (power gating), which minimizes the power consumption of inactive parts of the device. Modern battery technologies, such as solid-state batteries (SSBs), offer higher energy density and a higher level of safety, making them ideal for high-power miniature applications. These innovations make design and engineering more sustainable while ensuring longer device life.
The reliability and durability of miniaturized components are presenting greater challenges as they are more susceptible to mechanical and environmental damage. To ensure their reliability, the industrial design process needs to plan for the use of materials with high resistance to mechanical stress, such as aluminum oxide (Al2O3) or silicon carbide (SiC), commonly used in protective coatings. Thermal cycling tests, which involve exposing devices to rapid temperature changes, allow for the assessment of their durability under fluctuating climatic conditions. In addition, mechanical shock and moisture resistance tests help identify potential design weaknesses in miniature devices.
Precision in manufacturing goes hand in hand with the miniaturization of components. As they become smaller, designers and engineers must use increasingly precise manufacturing techniques. Industrial design plays a key role in the introduction of new manufacturing technologies and techniques. One such technique is photolithography, which uses ultraviolet light to create patterns on semiconductor substrates and is a primary method in the production of modern integrated circuits. To achieve even smaller structure sizes, electron beam lithography is used, which allows the creation of features less than 10 nanometers in size. This enables the production of advanced integrated circuits that power modern smartphones, computers and IoT devices.
Practical tips on designing compact devices
Combining interdisciplinary knowledge from areas such as electronics, materials science, thermodynamics, and mechanical engineering significantly influences the effectiveness of the miniaturization process. Collaboration between specialists from different fields helps avoid potential errors and optimize the design process at every stage. An example of this is the close cooperation between the teams responsible for electronics and mechanics to integrate cooling systems into electronic systems. Such an approach effectively improves thermal management in devices with high component density.
Testing prototypes early in the design phase identifies potential problems related to heat management, reliability, and energy efficiency. Regular iterations and adjustments based on test results help avoid costly mistakes in later phases of product development. An example is testing the shock and moisture resistance of devices under controlled conditions, which helps prepare the device for daily use and increases its durability.
Optimizing the PCB (printed circuit board) design to minimize traces and optimally arrange components can significantly reduce the size of the device and improve its performance. The use of multifunctional components makes it possible to replace several individual components with a single, more versatile module. An example of this approach is the use of integrated circuits that combine signal processing, power management, and wireless communication functions into a single module, which not only reduces the space taken up but also minimizes power loss.
Designing electronic devices in a modular fashion, with swappable functional modules, allows for easier upgrades and maintenance, which is important for long-term use. This approach maintains the compact form of the device while offering flexibility to adapt to new needs. The modular design is particularly effective in industrial applications and IoT systems, where rapid adaptation to changing requirements and technologies is essential.
The flexibility margin in the miniaturization process will enable future modifications and adaptation of devices to new technologies. Designs with overly restrictive requirements can limit the ability to make improvements or necessary changes, making it difficult to adapt to rapidly evolving materials and technological solutions. An example of a good approach is to leave a reserve of computational power or physical space for additional modules, which may be necessary when implementing new features in the future.
What will the future look like?
The development of technology and miniaturization of electronics is inevitable and is a natural direction that the industry has been following for decades. Innovation and technological advancements will continue to be a key component of industrial design and manufacturing of electronic devices, enabling the creation of ever more advanced devices. At Device Prototype, we are constantly keeping our finger on the pulse to deliver solutions tailored to future challenges, in line with best practices and design standards. With our openness to new technologies and innovative approaches, we are ready to shape the future of electronic device design together.
